Indian Institute of Technology Hyderabad has signed a Memorandum of Understanding (MoU) with Kaynes Semicon Private Limited to strengthen collaboration in semiconductor research, education and talent development. The agreement was formalised on Friday during SEMICON India 2026 at Yashobhoomi, India International Convention and Expo Centre in Dwarka, New Delhi. The partnership aims to bridge the gap between academic research and industry requirements in the semiconductor sector.
The collaboration will be facilitated through the Wadhwani Innovation Network Centre of Excellence (WIN CoE) at IIT Hyderabad. Under the framework, both organisations will explore joint research and development projects, research proposals and technical publications. The agreement also provides opportunities for faculty and research scholar exchanges, enabling knowledge transfer between the academic and industry environments.
Students will benefit from internship opportunities and project work at Kaynes Semicon facilities, gaining practical exposure to semiconductor technologies. The institutions plan to organise joint conferences, symposia, lectures, seminars and training programmes. Workshops and academic enrichment programmes led by IIT Hyderabad faculty and researchers are expected to provide Kaynes Semicon engineers with insights into developments in semiconductor and packaging technologies.
Prof. B S Murty, Director, IIT Hyderabad, said collaboration between academic research and industry can support the translation of work in advanced materials, electrical engineering and silicon technologies into practical applications. He highlighted the role of the institute’s research and innovation ecosystem in supporting semiconductor-related work. Prof. Mahendrakumar Madhavan, Dean (Alumni and Corporate Relations), IIT Hyderabad, emphasised that sustained interaction between academia and industry is important for developing technology and the research and skills required by the semiconductor sector.
Dr Shirshendu Mukherjee, Managing Director, Wadhwani Innovation Network, said the collaboration would provide opportunities to connect research, engineering talent and industry requirements through applied research and development and training. Raghu Panicker, CEO, Kaynes Semicon, said the partnership would facilitate engagement with researchers and students and provide opportunities to explore technologies related to semiconductor assembly, testing and packaging.
The MoU has an initial term of two years and may be renewed following a review of activities undertaken during the collaboration. Curriculum development is another area of focus, with both organisations exploring ways to align academic learning with evolving industry practices in semiconductor and packaging technologies. Specific programmes arising from the agreement will be implemented through separate arrangements between the relevant parties.
