ASIP Technologies, a semiconductor startup based in Hyderabad, and IIT Hyderabad have teamed up to create training programs in IC Packaging & Testing for graduates from IT, Polytechnic, and Engineering backgrounds at different levels. Venkat Simhadri, CEO of ASIP Technologies, announced that students will have access to their factories for hands-on training experiences. Both institutions will work together to develop advanced packaging courses at the Bachelor’s and Master’s levels.
In addition, the partnership between IIT-H faculty, students, and ASIP will focus on research and development activities, such as prototyping, characterization, and productization for Advanced Package designs. They will also collaborate on exploring new package materials and technologies. An internship program will be established to provide bachelor’s and master’s students with extended internships in areas of mutual interest.
Furthermore, an academic exchange program will promote collaboration between the two institutions, enriching the academic ecosystem and supporting translational research endeavors. The goal is to nurture talent and drive innovation in the field of IC Packaging & Testing.
